Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish
نویسندگان
چکیده
Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped -Cu 6 Sn 5 and continuous planar -(Cu 0.9 Ni 0.1) 6 Sn 5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional -Cu 3 Sn intermetallic layer is formed at the interface between the -Cu 6 Sn 5 and Cu pads after aging at 150°C, while the same type of intermetallic formation is inhibited in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. In addition, the coarsening of Ag 3 Sn precipitates also abates in the solder matrix of the Sn3Ag0.5Cu0.06Ni0.01Ge packages, which results in a slightly higher ball shear strength for the specimens .
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